This book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices. It explores fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications of 5G-and-beyond wireless communications. Future challenges and potential trends of 5G-and-beyond applications and related materials technologies are also addressed. Throughout this book, illustrations clarify core concepts, techniques, and processes. At the end of each chapter, references serve as a gateway to the primary literature in the field. This book is essential reading for today's students, scientists, engineers and professionals who want to understand the current status and future trends in materials advancement and component design in 5G and beyond, and acquire skills for selecting and using materials and 5G component design that takes economic and regulatory aspects into account.

Autorentext

Colin Tong is a materials expert with considerable professional experience in the past two decades. His research & development activities and industrial practices cover a broad range of different fields with a special focus on materials testing and characterization, component design and processing of advanced composite materials, metallurgy, thermal management of electronic packaging, electromagnetic interference shielding, integrated optical waveguides, functional metamaterials and metadevices, energy materials, as well as flexible and printed electronics. He holds a Ph.D. degree in Materials Science and Engineering, and a Master's as well as a Bachelor's degree in Materials and Mechanical Engineering. Dr. Tong has published six books, over 30 peer-reviewed papers, and he holds 9 patents. He is a senior member of IEEE (Institute of Electrical and Electronics Engineers). He received the Henry Marion Howe Medal from ASM International for his contribution to research and development on advanced aluminum composite materials in 1999.