Circuits and Systems for Future Generations of Wireless Communications

The explosive demand in wireless-capable devices, especially with the proliferation of multiple standards, indicates a great opportunity for adoption of wireless technology at a mass-market level. The communication devices of both today and the future will have not only to allow for a variety of applications, supporting the transfer of characters, audio, graphics, and video data, but they will also have to maintain connection with many other devices rather than with a single base station, in a variety of environments. Moreover, to provide various services from different wireless communication standards with higher capacities and higher data-rates, fully integrated and multifunctional wireless devices will be required.

Multifunctional circuits and systems can be made profitable by a large scale of integration, elimination of external components, reduction of silicon area, and extensive reuse of resources. Integration of (Bi)CMOS transceiver RF front-end and analog baseband circuits with computing CMOS circuits on the same silicon chip further reduces costs of multifunctional mobile devices.

However, as batteries continue to determine the lifetime and size of mobile equipment, further extension of capabilities of wearable and wireless devices will depend critically on the integrated circuits and systems solutions.

The demand for multifunctional and multi-mode wireless-capable devices is accompanied by many significant challenges at system, circuit, and technology levels.

In Circuits and Systems for Future Generations of Wireless Communications circuit and system solutions for multiple communication standards and future generations of wireless communications are discussed.

Auteur

Aleksandar Tasic: Qualcomm Incorporated, San Diego, California, USA, atasic@qualcomm.com

Wouter A. Serdijn: Department of Microelectronics, Electronics Research Laboratory, Delft University of Technology, Delft, the Netherlands, w.a.serdijn@tudelft.nl

Lawrence E. Larson: Radio Frequency Integrated Circuits Group University of California San Diego, La Jolla, CA, USA, larson@ece.ucsd.edu

Gianluca Setti: Department of Engineering (ENDIF), University of Ferrara Advanced Research Center on Electronic Systems (ARCES), University of Bologna, gianluca.setti@unife.it

Résumé
The idea for this book originated from a Special Session on Circuits and Systems for Future Generations of Wireless Communications that was presented at the 2005 InternationalSymposiumon Circuits and Systems, which was then followed by two Special Issues bearing the same title that appeared in the March and April 2008 issues of the IEEE Transactions on Circuits and Systems Part II: Express Briefs. Out of a large number of great contributions, we have selected those tting best the book format based on their quality. We would like to thank all the authors, the reviewers of the Transactions on Circuits and Systems Part II, and the reviewers of the nal book material for their efforts in creating this manuscript. We also thank the Springer Editorial Staff for their support in putting together all the good work. We hope that this book will provide you, the reader, with new insights into Circuits and Systems for Future Generations of Wireless Communications.

Contenu
A Multimode Radio Transceiver for Cellular Applications.- Reconfigurable Multi-Band OFDM UWB Receivers: Circuits and System Considerations.- Low Power UWB Circuits: Front-End Building Blocks.- CMOS IR-UWB Transceiver System Design for Contact-Less Chip Testing Applications.- Multi-mode Power Amplifiers for Wireless Handset Applications.- Polyphase Multipath Circuits for Cognitive Radio and Flexible Multi-phase Clock Generation.- IIP2 Improvement Techniques for Multi-standard Mobile Radio.- Multi-standard Continuous-Time SigmaDelta Converters for 4G Radios.- Power Efficient Reconfigurable Baseband Filters for Multimode Radios.- An Adaptive Digital Front-End for Multi-mode Wireless Receivers.- FEC Decoders for FutureWireless Devices: Scalability Issues and Multi-standard Capabilities.