IC Component Sockets

Informationen zum Autor WEIFENG LIU, PHD, is an Interconnect Specialist at the Business Critical Systems Organization of Hewlett Packard Company. A member of IMAPS and IEEE, he has published numerous papers and has one patent pending. MICHAEL G. PECHT, PHD, is a professional engineer and a Fellow of IEEE and ASME. He is the founder and director of the CALCE Electronic Products and Systems Center at the University of Maryland. Among the awards he has received are the 3M Research Award, the IEEE Undergraduate Teaching Award, and the IMAPS William D. Ashman Memorial Achievement Award for his contributions in the field. He has written sixteen books on electronic product development, served as chief editor of the IEEE Transactions on Reliability , and served on the Advisory Board of IEEE Spectrum . Klappentext A BROAD AND PRACTICAL REFERENCE TO IC SOCKET TECHNOLOGY The first and only comprehensive resource on IC (Integrated Circuit) socket technology, IC Component Sockets offers a complete overview of socket technology and design in order to provide engineers and their managers with a good understanding of these specialized technologies and the processes for evaluating them. The authors, both acknowledged experts in the field, address all relevant aspects of the subject--including materials, design, performance characteristics, failure modes and mechanisms, and qualification and reliability assessment--with emphasis on the technology's inherent advantages and challenges. Topics of interest include: Socket design and contact technologies Performance characteristics and material properties Contact failure modes and mechanisms Qualification testing conditions Qualification sequences and setup IEEE prediction methodology Theoretical calculation of contact reliability Including a list of standards and specifications, this book is an important and timely resource for today's electronics engineers concerned with evaluating and perfecting socket design, manufacture, and use Zusammenfassung Although Integrated Circuit (IC) component sockets have assumed an essential role in IC design! test! and performance upgrade! there is currently no single source covering all aspects of IC component sockets. Inhaltsverzeichnis Preface xi 1 IC Component Socket Overview 1 1.1 Levels of Interconnections 1 1.2 Component-to-Board Interconnection 2 1.3 Classification of Component Sockets 3 1.4 Structure of IC Component Sockets 4 1.4.1 Socket Housing 5 1.4.2 Socket Contact 8 1.4.3 Socket Actuation 8 1.4.4 Heat Sink 9 1.4.5 Socket Polarization 10 1.5 Socket Function 10 1.6 Socket Assembly 11 1.7 Benefits of Using IC Component Sockets 11 1.7.1 Component Test and Burn-in 11 1.7.2 Component Upgrade and Exchange 12 1.7.3 Flexibility in IC Design and Assembly and Supply Chain Management 13 1.7.4 Use of Sockets to Avoid Soldering 13 1.7.5 Component Replacement and Repair 14 1.7.6 Cost Savings 14 1.8 Challenges Facing IC Component Sockets 15 1.8.1 Extra Signal Path 15 1.8.2 Increased Assembly Area 15 1.8.3 Compatibility with Fine-Pitch Applications 15 1.8.4 Reliability 16 1.9 IC Component Socket Market 17 1.10 Summary and Future Directions 18 References 18 2 Component Socket Properties 21 2.1 Socket Contact 21 2.1.1 Insertion and Extraction Force 21 2.1.2 Contact Retention 24 2.1.3 Contact Force and Resistance 25 2.1.4 Contact Deflection and Resistance 27 2.1.5 Contact Wipe 29 2.1.6 Current Rating 31 2.1.7 Capacitance and Inductance 32 2.1.8 Bandpass and Bandwidth 35 2.2 Socket Housing 37 2.2.1 Electrical Properties 37 2.2.2 Mechanical Properties 39 WEIFENG LIU, PHD, is an Interconnect Specialist at the Business Critical Systems Organization of Hewlett Packard Company. A member of IMAPS and IEEE, he has published numerous papers and has one patent pending.

MICHAEL G. PECHT, PHD, is a professional engineer and a Fellow of IEEE and ASME. He is the founder and director of the CALCE Electronic Products and Systems Center at the University of Maryland. Among the awards he has received are the 3M Research Award, the IEEE Undergraduate Teaching Award, and the IMAPS William D. Ashman Memorial Achievement Award for his contributions in the field. He has written sixteen books on electronic product development, served as chief editor of the IEEE Transactions on Reliability, and served on the Advisory Board of IEEE Spectrum.

Texte du rabat

A BROAD AND PRACTICAL REFERENCE TO IC SOCKET TECHNOLOGY The first and only comprehensive resource on IC (Integrated Circuit) socket technology, IC Component Sockets offers a complete overview of socket technology and design in order to provide engineers and their managers with a good understanding of these specialized technologies and the processes for evaluating them. The authors, both acknowledged experts in the field, address all relevant aspects of the subject--including materials, design, performance characteristics, failure modes and mechanisms, and qualification and reliability assessment--with emphasis on the technology's inherent advantages and challenges. Topics of interest include:

• Socket design and contact technologies
• Performance characteristics and material properties
• Contact failure modes and mechanisms
• Qualification testing conditions
• Qualification sequences and setup
• IEEE prediction methodology
• Theoretical calculation of contact reliability Including a list of standards and specifications, this book is an important and timely resource for today's electronics engineers concerned with evaluating and perfecting socket design, manufacture, and use

Résumé
Although Integrated Circuit (IC) component sockets have assumed an essential role in IC design, test, and performance upgrade, there is currently no single source covering all aspects of IC component sockets.

Contenu

Preface xi

1 IC Component Socket Overview 1

1.1 Levels of Interconnections 1

1.2 Component-to-Board Interconnection 2

1.3 Classification of Component Sockets 3

1.4 Structure of IC Component Sockets 4

1.4.1 Socket Housing 5

1.4.2 Socket Contact 8

1.4.3 Socket Actuation 8

1.4.4 Heat Sink 9

1.4.5 Socket Polarization 10

1.5 Socket Function 10

1.6 Socket Assembly 11

1.7 Benefits of Using IC Component Sockets 11

1.7.1 Component Test and Burn-in 11

1.7.2 Component Upgrade and Exchange 12

1.7.3 Flexibility in IC Design and Assembly and Supply Chain Management 13

1.7.4 Use of Sockets to Avoid Soldering 13

1.7.5 Component Replacement and Repair 14

1.7.6 Cost Savings 14

1.8 Challenges Facing IC Component Sockets 15

1.8.1 Extra Signal Path 15

1.8.2 Increased Assembly Area 15

1.8.3 Compatibility with Fine-Pitch Applications 15

1.8.4 Reliability 16

1.9 IC Component Socket Market 17

1.10 Summary and Future Directions 18

References 18

2 Component Socket Properties 21

2.1 Socket Contact 21

2.1.1 Insertion and Extraction Force 21

2.1.2 Contact Retention 24

2.1.3 Contact Force and Resistance 25

2.1.4 Contact Deflection and Resistance 27

2.1.5 Contact Wipe 29

2.1.6 Current Rating 31

2.1.7 Capacitance and Inductance 32

2.1.8 Bandpass and Bandwidth 35

2.2 Socket Housing 37

2.2.1 Electrical Properties 37

2.2.2 Mechanical Properties 39

2.2.3 Temperature Rating 41

2.2.4 Flammability 42

2.3 Summary 43

References 43

3 IC Component Socket Materials 45

3.1 Socket Housing 45

3.1.1 Polymer Fundamentals 45

3.1.2 Thermoplastics 47

3.1.3 Thermosetting Polymers 50

3.1.4 Additives 52

3.1.5 Housing Manufacturing 53

3.2 Socket Contact 53

3.2.1 Copper Alloys 54

3.2.2 Nickel Alloys 59

3.2.3 Conductive Elastomers 60

3.2.4 Contact Manufacturing 61

3.3 Socket Contact Plating 64

3.3.1 Noble Metal Plating 65

3.3.2 Non-Noble Metal Plating 69

3.3.3 Underplate 70

3.3.4 Plating Process 71

3.4 Summary 74

References 74

**4 Compon…