Design and Application of Intelligent Thermally Conductive Materials

Auteur
Professor Feng Wei is based at Tianjin University, China. He serves as a member of the 7th and 8th Academic Committee of Science and Technology Commission of the Ministry of Education, an executive director of the Chinese Society for Composite Materials, the first chairman of the Thermal Conductive Composites Committee of the Chinese Society for Composite Materials, and an executive director of the Polymer Materials and Engineering Branch of the Chinese Society for Materials Research. He is mainly engaged in the research of functional organic carbon composites and their applications, including high thermal conductivity materials, high-performance photothermal conversion and storage materials, structural fluorinated carbon materials, and bionic smart materials

Texte du rabat

Design and Application of Intelligent Thermally Conductive Materials is a current, comprehensive, reference resource, providing information on the structure, design and application of these newly developed materials in various contexts, together with an analysis of future trends and applications. The focus on intelligent thermally conductive materials sets the book apart from other works, which deal with traditional materials. The book provides postgraduates and senior undergraduates with an essential overview of thermal conductivity, from which to appreciate the descriptions of intelligent thermal conductivity. For all readers, including researchers, industry professionals and technicians in the field, chapters on the structure, design, development and performance of intelligent thermal conductive materials provide essential information. The author presents a detailed description of the application of these intelligent materials to a wide range of uses, and also of their particular importance in the development and application of advanced chips. While the potential future demand for these materials is enormous, the author indicates where developmental, technical and production bottlenecks may occur. The possible use of intelligent thermal conductive materials in a wide range of contexts is discussed, together with their potential for energy saving and resource conservation.

Contenu

1. Overview of thermal conductivity
   
   2. Overview of intelligent thermal conductive materials
   3. Design of intelligent performance
   4. Design of intelligent thermal conductive materials
   5. Application of intelligent thermal conductive materials
   6. Application of intelligent thermal conductive materials in advanced chips
   7. Conclusions and outlook