Lead-Free Soldering

LeadFree Soldering is written as a practical reference guide for engineers scrambling to meet the requirements of and push toward lead-free components and in turn lead-free soldering in computers, cell phones and other electronic assemblies. This task has taken on greater urgency worldwide but especially in the European Union with the implementation of the Requirements of Hazardous Substances (RoHS), that will go into effect on July 1, 2006 and with pending implementation of laws in China and California.

Contains practical knowledge of lead-free soldering subjects which are difficult to interpret and review from other sources Contains the latest information on proposed changes to lead-free standards that are being implemented by the authors Contains the latest information on government and legislative activities and regulations in North America, Europe and Asia Includes supplementary material: sn.pub/extras

Texte du rabat

The push toward lead-free soldering in computers, cell phones and other electronic and electrical devices has taken on a greater urgency as laws have been passed or are pending in the United States, the European Union and Asia which ban lead-bearing solder. These new restrictions on hazardous substances are changing the way electronic devices are assembled, and specifically affect process engineering, manufacturing and quality assurance.

Lead-Free Soldering offers in a single volume a broad collection of practical techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources. The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia.

Written by recognized experts in both academia and industry, Lead-Free Soldering is a must-have guide for practicing engineers interested in the latest developments surrounding areas such as lead-free alloy properties, reflow, wave, rework , solder joint reliability, PCB laminates and surface finishes, and backward and forward compatibility.

Contenu
Lead Restrictions and Other Regulatory Influences on the Electronics Industry.- Fundamental Properties of Pb-Free Solder Alloys.- Lead-Free Surface Mount Assembly.- Lead-Free Wave Soldering.- Lead-Free Rework.- Lead-Free Solder Joint Reliability.- Backward and Forward Compatibility.- PCB Laminates.- Lead-Free Board Surface Finishes.- Lead-Free Soldering Standards.