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As a reference book, the Springer Handbook provides a comprehensive exposition of the techniques and tools of experimental mechanics. An informative introduction to each topic is provided, which advises the reader on suitable techniques for practical applications.
The Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods for experimental studies of materials, components, and structures. The emergence of new materials and new disciplines, together with the escalating use of on- and off-line computers for rapid data processing and the combined use of experimental and numerical techniques have greatly expanded the capabilities of experimental mechanics. New exciting topics are included on biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics.
Presenting complete instructions to various areas of experimental solid mechanics, guidance to detailed expositions in important references, and a description of state-of-the-art applications in important technical areas, this thoroughly revised and updated edition is an excellent reference to a widespread academic, industrial, and professional engineering audience.
Presents extensively revised chapters in addition to coverage of new areas of increasing importance in experimental mechanics. Describes state-of-the-art technical applications of experimental solid mechanics. Offers up-to-date references to optimum sources. Includes detailed index and fully searchable DVD with supplementary media. Includes supplementary material: sn.pub/extras
Texte du rabat
The Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods for experimental studies of materials, components, and structures. The emergence of new materials and new disciplines, together with the escalating use of on- and off-line computers for rapid data processing and the combined use of experimental and numerical techniques have greatly expanded the capabilities of experimental mechanics. New exciting topics are included on biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics.
Presenting complete instructions to various areas of experimental solid mechanics, guidance to detailed expositions in important references, and a description of state-of-the-art applications in important technical areas, this thoroughly revised and updated edition is an excellent reference to a widespread academic, industrial, and professional engineering audience.
Contenu
Part A Solid Mechanics Topics Chap. 1 Analytical Mechanics of Solids.- Chap. 2 Materials Science for the Experimental Mechanist.- Chap. 3 Polymers and Viscoelasticity.- Chap. 4 Composite Materials.- Chap. 5 Fracture Mechanics.- Chap. 6 Active Materials.- Chap. 7 Biological Soft Tissues.- Chap. 8 Ionic Polymer-Metal Composites.- Chap. 9 MEMS and NEMS.- Chap. 10 Hybrid Methods. Chap. 11 Statistical Analysis of Experimental Data.
Part B Contact Methods Chap. 12 Electrical Resistance Strain Gages.- Chap. 13 Extensometers.- Chap. 14 Fiber Strain Gages.- Chap. 15 Residual Stress Measurement.- Chap. 16 Nanoindentation.- Chap. 17 Atomic Force Microscopy.
Part C Noncontact Methods Chap. 18 Basics of Optics.- Chap. 19 Image Analysis and Processing.- Chap. 20 Digital Image Correlation.- Chap. 21 Geometric Moiré.- Chap. 22 Moiré Interferometry.- Chap. 23 Speckle Methods.- Chap. 24 Holography.- Chap. 25 Photoelasticity.- Chap. 26 Thermoelastic Stress Analysis.- Chap. 27 Photoacoustic Characterization of Materials.- Chap. 28 X-Ray Stress Analysis.
Part D Applications Chap 29 Optical Methods.- Chap. 30 Mechanical Testing at the Micro/Nano Scale.- Chap. 31 Biological Tissue Testing.- Chap. 32 Biomedical Devices and Biologically Inspired Materials.- Chap. 33 High Strain Rate and Impact Testing.- Chap. 34 Delamination Mechanics.- Chap. 35 Structural Testing Applications.- Chap. 36 Electronic Packaging.